Description
WHAT YOU DO AT AMD CHANGES EVERYTHING
We care deeply about transforming lives with AMD technology to enrich our industry, our communities, and the world. Our mission is to build great products that accelerate next-generation computing experiences – the building blocks for the data center, artificial intelligence, PCs, gaming and embedded. Underpinning our mission is the AMD culture. We push the limits of innovation to solve the world's most important challenges. We strive for execution excellence while being direct, humble, collaborative, and inclusive of diverse perspectives.
AMD together we advance_
THE ROLE:
AMD is seeking a skilled PCB Design Engineer with expertise in high-performance, multi-layer board design. This role will lead PCB architecture and layout for cutting-edge platforms, directly impacting system performance, manufacturability, and power delivery. The ideal candidate will bring advanced knowledge of Cadence Allegro or equivalent tools, high-speed interfaces, and complex BGA architecture trade-offs.
THE PERSON:
You are a highly skilled PCB design engineer who thrives in fast-paced, collaborative environments. You have strong technical expertise in high-speed board design and SI/PI, with the ability to optimize system-level performance and guide critical design trade-offs. You excel at cross-functional collaboration and mentoring, and are motivated to deliver high-quality, manufacturable designs.
KEY RESPONSIBILITIES:
Lead PCB layout and architecture for high-speed systems, including DDR5, PCIe Gen5/Gen6, USB4, and 100G+ Ethernet.
Evaluate BGA fan-out strategies, layer stackups, and interface placement for signal integrity and power delivery.
Collaborate with electrical, mechanical, and SI/PI teams to optimize performance and manufacturability.
Design complex multi-layer boards (12+ layers) incorporating HDI techniques, blind/buried vias, and controlled impedance routing.
Perform SI/PI simulations and guide layout decisions based on analysis results.
Generate fabrication and assembly documentation (Gerbers, ODB++, BOMs, fabrication notes).
Interface with vendors to ensure DFM/DFT compliance and cost-effective production.
Mentor junior engineers and contribute to process and methodology improvements.
PREFERRED EXPERIENCE:
Proficiency in Cadence Allegro or similar EDA tools.
Strong knowledge of BGA layout constraints, power delivery networks, and interface optimization.
Experience with DDR5, PCIe Gen5/Gen6, USB4, and other high-speed protocols.
Familiarity with SI/PI simulation tools such as Sigrity or HyperLynx.
IPC CID or CID+ certification strongly preferred.
Experience with thermal modeling and mechanical integration.
Hands-on lab experience with board bring-up and debug.
Knowledge of regulatory compliance standards (EMC, FCC, CE).
ACADEMIC CREDENTIALS:
Bachelor's or Master's degree in Electrical Engineering or related technical field (minimum Bachelor's required).
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Benefits offered are described: AMD benefits at a glance.
AMD does not accept unsolicited resumes from headhunters, recruitment agencies, or fee-based recruitment services. AMD and its subsidiaries are equal opportunity, inclusive employers and will consider all applicants without regard to age, ancestry, color, marital status, medical condition, mental or physical disability, national origin, race, religion, political and/or third-party affiliation, sex, pregnancy, sexual orientation, gender identity, military or veteran status, or any other characteristic protected by law. We encourage applications from all qualified candidates and will accommodate applicants' needs under the respective laws throughout all stages of the recruitment and selection process.
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