Photonics IC Top Level Integration Engineer Job Listing at AMD in Markham, ON (Job ID 86910-en-us)

Description

WHAT YOU DO AT AMD CHANGES EVERYTHING 

At AMD, our mission is to build great products that accelerate next-generation computing experiences—from AI and data centers, to PCs, gaming and embedded systems. Grounded in a culture of innovation and collaboration, we believe real progress comes from bold ideas, human ingenuity and a shared passion to create something extraordinary. When you join AMD, you'll discover the real differentiator is our culture. We push the limits of innovation to solve the world's most important challenges—striving for execution excellence, while being direct, humble, collaborative, and inclusive of diverse perspectives. Join us as we shape the future of AI and beyond.  Together, we advance your career.  

THE ROLE:

We are seeking a Photonic Integration Engineer with expertise in photonic integrated circuit (PIC) implementation, physical design, verification, and packaging integration. In this role, you will contribute to the development of scalable physical design methodologies, verification flows, and automation frameworks that support successful product tapeouts and high-volume manufacturing.

You will work across photonic, electrical, and packaging domains to help enable robust integration of complex mixed-signal and optical systems while supporting efficient design and signoff processes.

THE PERSON:

You are a hands-on engineer with experience in photonic integrated circuits, semiconductor physical design, and design automation. You enjoy working in multidisciplinary environments and have a solid understanding of how photonic devices, electronic circuits, and packaging technologies come together in integrated systems.

You will contribute to top-level chip integration, physical implementation, and signoff activities while collaborating closely with photonic design, electrical design, process technology, and packaging teams. This role involves developing automated layout generation methodologies, improving verification workflows, and helping ensure manufacturability, reliability, and performance across electro-photonic products.

KEY RESPONSIBILITIES:

• Contribute to the top-level integration and physical implementation of photonic integrated circuits (PICs), electro-photonic subsystems, and co-packaged optical solutions.
• Develop and maintain script-based layout generation and physical design automation frameworks using Python, Julia, SKILL, TCL, or equivalent scripting languages.
• Support full-chip physical verification and signoff activities, including DRC, LVS, ERC, and photonic verification flows.
• Perform and analyze EM/IR, power integrity, reliability, and ESD verification.
• Collaborate with photonic device engineers to integrate waveguides, modulators, detectors, couplers, and other optical building blocks into production-ready layouts.
• Work with analog, mixed-signal, RF, and digital design teams to support electrical and photonic system integration.
• Assist in developing and optimizing physical design methodologies, floorplanning strategies, hierarchical integration flows, and tapeout processes.
• Support package-aware design and verification activities, including optical packaging, fiber attach strategies, thermal management, signal integrity, and co-packaged optics architectures.
• Contribute to automation infrastructure, verification methodologies, and design best practices across photonic and electrical design environments.
• Support silicon bring-up, root-cause analysis, and correlation of physical design assumptions with silicon and module-level test results.

PREFERRED EXPERIENCE:

• Experience in photonic integrated circuit (PIC) design, physical implementation, and top-level integration in production or advanced R&D environments.
• Experience with physical design and implementation tools such as Cadence Innovus, Virtuoso, and related semiconductor design environments.
• Experience developing script-based layout generation and design automation frameworks using Python, Julia, TCL, SKILL, or equivalent programming languages.
• Understanding of physical verification methodologies, including DRC, LVS, ERC, and photonic verification flows.
• Familiarity with EM/IR, power integrity, reliability, and ESD verification.
• Knowledge of silicon photonics technologies, photonic device integration, and electro-photonic system architectures.
• Understanding of advanced packaging technologies, including co-packaged optics, optical module integration, fiber attach methodologies, thermal management, and heterogeneous integration.
• Experience collaborating with photonics, electrical, packaging, process, and manufacturing teams.
• Exposure to silicon or photonic product tapeouts is considered an asset.

ACADEMIC CREDENTIALS:

• MASc or PhD in Electrical Engineering, Photonics, Optics, Applied Physics, Semiconductor Engineering, or a related discipline preferred.

LOCATION: Markham, ON

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Benefits offered are described:  AMD benefits at a glance.

AMD does not accept unsolicited resumes from headhunters, recruitment agencies, or fee-based recruitment services. AMD and its subsidiaries are equal opportunity, inclusive employers and will consider all applicants without regard to age, ancestry, color, marital status, medical condition, mental or physical disability, national origin, race, religion, political and/or third-party affiliation, sex, pregnancy, sexual orientation, gender identity, military or veteran status, or any other characteristic protected by law.   We encourage applications from all qualified candidates and will accommodate applicants' needs under the respective laws throughout all stages of the recruitment and selection process.

AMD may use Artificial Intelligence to help screen, assess or select applicants for this position.  AMD's “Responsible AI Policy” is available here.

This posting is for an existing vacancy.